… Figure 1c,d are the stacked integration methods focused on in this paper. … and the MEMS
devices are transferred to the surface of the LSI wafer 1 (4). The MEMS dies remaining on the …

… The CMOS-MEMS technology enables the integration of CMOS circuits with MEMS
structures in a single chip. The CMOS-MEMS devices attract attention due to its potential for the …

… advanced MEMS devices requiring the bonding of multiple wafer stacks, MEMS technologists
must be very observant during each step of the production of the wafers and stacks …

… such devices into a 3D stack implies additional challenges compared to 3D stacks consisting
solely … In order to achieve truly compact, 3D stacked MEMS units, it is necessary to provide …

… , such as using automated dispenser printers, or wafer bonding devices, can improve the
precision of the alignment of the stacked layers and even further reduce the error that is …

… to perform such stacking in a cost-effective manner. In this paper, a novel 3D TSV and 3D
stacking technologies will be presented. Application examples are MEMS packaging and …

… due to the stacked-electrode … device was able to carry in excess of 1 A without contact
failure. For reference to the fabricated MEMS relay being used in RF applications, the device exhib…

… Since MEMS device require an ASIC chip and also the trend is stacking of MEMS device
with other electronic chips, stacking of MEMS device is crucial to meet the performance as well …

… stress in the stacked thin-film CMOS layers pose a challenge for device performance. …
for some small devices such as RF MEMS and thermal sensors, for devices such as inertial …

… dedicated MEMS … stacked in a package in this way, such a system is also referred to as a
system-in-package or a vertical multi-chip module 2 . Devices created through vertical stacking …