… compromised reliability, or at the very least, manufacturing can result in low stacking yield.
The last iterative step of the 3D integration is to remove the handle wafer of the top wafer; …

… this can be found in the escalating requirements for DRAM and other memory modules. [ I ] …
through BGA solder balls in order to form a multi-chip CSP that fits within a footprint nearly the …

… applicable to 272 BGA multi-chip module (MCM). Usually stacked MCM becomes easily …
method and show parametric optimization to design a heat exchanger using polymer. …

… of advanced molding techniques for multi-chip embedding in … from printed circuit board
manufacturing with focus on … for the generation of stackable multi chip SiP modules. Technology …

… such as stacking structure, cooling mode, and power consumption distribution, making
thermal … The technology can be used for multi-chip packages, so we constructed a stack layout …

… multi-chip packages, manufacturers have started looking at 3D packaging. The 3D structures
have either dies or chips stacked … aware test scheduling techniques for stacked structures is …

… stacking of die layers in multichip modules (MCMs). Extremely high integration density can
be achieved with these modules. … However, for low volume production these modules offer an …

… techniques. For low power chips, the flex can be folded to form 3-D modules with thinned
stacked … added to the manufacturing process and the result is a common way to build organic …

… New design approaches are needed in particular for parallel multi-chip … modules, focusing
in particular on module designs compatible with the most widely established manufacturing, …

… stacking technology is necessary to simplify and reduce the packaging structure, which is
used for multi-chip … SOC-like multi-layer and multi-chip stacking capabilities, which is similar to …