Thermal measurement and numerical analysis for automotive power modules
A Sitta, M Renna, AA Messina… - … and Multi-Physics …, 2020 - ieeexplore.ieee.org
2020 21st International Conference on Thermal, Mechanical and …, 2020•ieeexplore.ieee.org
The presented analysis has been aimed to evaluate the impact of die solder and sintering
solution for automotive power modules in terms of thermal behavior. First, dedicated
temperature measurements have been performed to evaluate the module thermal
impedance in the two cases. Then, a lumped equivalent networks has been calculated, by
means of a dedicated numeric, and finally function structures have been extracted
solution for automotive power modules in terms of thermal behavior. First, dedicated
temperature measurements have been performed to evaluate the module thermal
impedance in the two cases. Then, a lumped equivalent networks has been calculated, by
means of a dedicated numeric, and finally function structures have been extracted
The presented analysis has been aimed to evaluate the impact of die solder and sintering solution for automotive power modules in terms of thermal behavior. First, dedicated temperature measurements have been performed to evaluate the module thermal impedance in the two cases. Then, a lumped equivalent networks has been calculated, by means of a dedicated numeric, and finally function structures have been extracted
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