Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites

SML Nai, JVM Kuma, ME Alam, XL Zhong… - Journal of Materials …, 2010 - Springer
In the present study, Sn-0.7 Cu and Sn-3.5 Ag lead-free solders used in the electronics
packaging industry were reinforced with different volume percentages of nano-size alumina
and tin oxide particulates, respectively, to synthesize two new sets of nanocomposites.
These composites were developed using microwave-assisted powder metallurgy route
followed by extrusion. The effects of addition of particulates on the physical, microstructural,
and mechanical properties of the nanocomposites were investigated. Mechanical properties …

Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites

M Gupta, SML Nai, JVM Kuma… - … , MS and T'08, 2008 - research.manchester.ac.uk
In the present study, Sn-0.7 Cu and Sn-3.5 Ag lead-free solders used in the electronics
packaging industry were reinforced with different volume percentages of nano-size alumina
and tin oxide particulates, respectively, to synthesize two new sets of nanocomposites.
These composites were developed using microwave assisted powder metallurgy route
followed by extrusion. The effects of addition of particulates on the physical, microstructure
and mechanical properties of nanocomposites were investigated. Mechanical properties …
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