Etching characteristics of TiN used as hard mask in dielectric etch process

M Darnon, T Chevolleau, D Eon, L Vallier… - … Structures Processing …, 2006 - pubs.aip.org
etching characteristics of a TiN hard mask in terms of etch rate and faceting when using a
dielectric etch process. … the etching characteristics of a TiN hard mask in terms of etch rate and …

[HTML][HTML] Etch mechanism of an Al2O3 hard mask in the Bosch process

M Drost, S Marschmeyer, M Fraschke… - Micro and Nano …, 2022 - Elsevier
… Therefore, the objective of this work is to scrutinize the Al 2 O 3 hard mask etch mechanism
… possible chemical changes at the mask surface over the course of a DRIE process. To do so, …

Development of multi-function hard mask to simplify process step

K Lee, S Kim, G Lee, S Lee, J Cho… - … and Processing …, 2006 - spiedigitallibrary.org
… Moreover, ArF photoresist has the inherent demerit of poor etchprocess (TLR)1 have
been investigated. This paper will focus on TLR process consisted of multi-function hard mask (…

[PDF][PDF] Etch mechanism of an Al₂O₃ hard mask in the Bosch process

M Drost, S Marschmeyer, M Fraschke… - Micro and Nano …, 2022 - opus4.kobv.de
… Therefore, the objective of this work is to scrutinize the Al2O3 hard mask etch mechanism …
of possible chemical changes at the mask surface over the course of a DRIE process. To do so, …

Silicon deep reactive ion etching with aluminum hard mask

A Bagolini, P Scauso, S Sanguinetti… - Materials Research …, 2019 - iopscience.iop.org
… As microloading is a constant effect during all the etching process, all depth samples were
normalized with respect to the microloading profile obtained form set 1 data, to eliminate the …

Surface analysis of amorphous carbon thin film for etch hard mask

KP Kim, WS Song, MK Park… - Journal of Nanoscience …, 2021 - ingentaconnect.com
… dry-etching to investigate the effect of the deposition process condition on the surface
characteristics of an ACL film to be used as a dry etch hard mask in an HAR etch process. … process

… analysis of amorphous carbon films deposited from (C6H12)/Ar/He chemistry for application as the dry etch hard mask in the semiconductor manufacturing process

S Lee, J Won, J Choi, S Jang, Y Jee, H Lee, D Byun - Thin Solid Films, 2011 - Elsevier
… a dry etch hard mask with high etching selectivity, easy removal by photo resist strip process
… , dry etch rate, extinction coefficient, and cleaning removal amount for application as the dry …

Fabrication of a hard mask for InP based photonic crystals: Increasing the plasma-etch selectivity of poly(methyl methacrylate) versus and

R Wüest, P Strasser, F Robin, D Erni… - … Structures Processing …, 2005 - pubs.aip.org
… ion etching processes for SiO2 and SiNx hard masks where the fluorine-based etch steps …
For SiO2 etching an etch-step duration of 30 s resulted in a doubled selectivity of almost 4:1 …

Negative hybrid sol–gel resist as hard etching mask for pattern transfer with dry etching

G Grenci, G Della Giustina, A Pozzato… - Microelectronic …, 2012 - Elsevier
… A very high etch selectivity, in excess of 60, for silicon etching process towards the mask
in etching processes with fluorine plasma chemistry were achieved. Future work will focus on …

Integration of Cu and low-k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures

RA Donaton, B Coenegrachts, M Maenhoudt… - Microelectronic …, 2001 - Elsevier
… selection of hard mask material and thickness and the choice of the right dry etch process for
… the effect of using different hard mask materials and dry etch processes on the integration of …