Representative techniques and devices, including process steps may be employed to
mitigate undesired dishing in conductive interconnect structures and erosion of dielectric …

Dies and/or wafers are stacked and bonded in various arrangements including stacks, and
may be covered with a molding to facilitate handling, packaging, and the like. In various …

Representative implementations provide techniques for processing integrated circuit (IC)
dies and related devices, in preparation for stacking and bonding the devices. The disclosed …

Representative implementations of techniques and methods include processing singulated
dies in preparation for bond ing. A plurality of semiconductor die components may be …

BACKGROUND The present disclosure generally relates to the field of electronics. More
particularly, an embodiment of the inven tion relates to die backside wire bond technology. A …

0002 Current technology for fabricating integrated cir cuits produces a two-dimensional
Structure. For a given proceSS technology, an increase in performance and func tionality of …

BACKGROUND A common requirement of current integrated circuit manu facturing and
packaging is the use of interposers to receive single or multiple integrated circuit dies. The …

BACKGROUND In three-dimensional integrated circuit (3DIC) formation processes, device
dies may be bonded to a wafer. Typically, after the bonding of the dies onto the wafer, a …

BACKGROUND First-level interconnect (FLI) structures may include bulk solder interconnect
structures to couple a die with another component (eg, another die or Substrate) of an …

BACKGROUND The semiconductor industry has experienced rapid growth due to
continuous improvements in the integration density of a variety of electronic components …