BACKGROUND 0002 Optical signals may be used to communicate infor mation between
integrated circuits (ICs) such as ICs formed on different dies. Present techniques to optically …

BACKGROUND Optical signals may be used to communicate information between
integrated circuits (ICs) such as ICs formed on dif ferent dies. Present techniques to optically …

BACKGROUND [0002] Integrated devices including semiconductors and other materials,
may have improved performance and/or functionality. For example, photonic circuits may be …

BACKGROUND Semiconductor devices are used in a variety of electronic applications, such
as personal computers, cell phones, digi tal cameras, and other electronic equipment, as …

BACKGROUND Stacked die ICs may be formed from different interposer dies (“interposers').
These interposers may have different sizes and accommodate different types and/or …

BACKGROUND 0002 Advances in the design and manufacture of semi conductor devices
have led to shrinking sizes of semiconduc torpackages, wafers, and dies/chips. As …

Representative techniques and devices, including process steps may be employed to
mitigate undesired dishing in conductive interconnect structures and erosion of dielectric …

BACKGROUND Typically, in a semiconductor device, various electronic components (eg,
transistors, diodes, resistors, capacitors, and the like) are formed in device dies on a wafer …

US7831115B2 - Optical die structures and associated package substrates - Google Patents
US7831115B2 - Optical die structures and associated package substrates - Google Patents …

BACKGROUND 0001 Packaging for dies that include, for example, at least one integrated
circuit (IC), is continually trending towards reduced package size with increased package …