Techniques and architectures for providing a reflective target area of an integrated circuit die
assembly. In an embodiment, a reflective bevel surface of a die allows an optical signal to be …

BACKGROUND In attaching dies to Substrate, a joint or electrical coupling is used between
the die and the substrate. In preparing the joint, high temperatures exceeding 300 C. may be …

Representative implementations of techniques and methods include processing singulated
dies in preparation for bond ing. A plurality of semiconductor die components may be …

Representative implementations provide techniques for processing integrated circuit (IC)
dies and related devices, in preparation for stacking and bonding the devices. The disclosed …

BACKGROUND 0003. The background description provided herein is for the purpose of
generally presenting the context of the disclo sure. Work of the presently named inventors, to …

BACKGROUND Semiconductor devices are used in a variety of electronic applications, such
as personal computers, cellphones, digital cameras, and other electronic equipment …

(57) ABSTRACT A thermal management system is described which may be implemented on
a semiconductor die. The system may include a thermal sensor thermally coupled to the die …

(57) ABSTRACT A packaged component may include an interposer and inte grated circuit
dies mounted on the interposer. At least one of the dies may be a radiation-hardened …

Interposers are used for integrated circuit packaging, typi cally for routing connections
between semiconductor dies and packaging components. For example, semiconductor dies …

As manufacturers of integrated circuit devices, electronic devices, and computing systems
strive to reduce package form factors and size, while also improving performance and …