Semiconductor devices having one or more vias filled with a transparent and electrically
conductive material are disclosed herein. In one embodiment, a semiconductor device …

BACKGROUND 0001 Advances in integrated circuit (“IC) packaging techniques allow
designers to fabricate IC packages that continue to decrease in size and increase in power …

Examples described herein generally relate to forming and/or configuring a die stack in a
multi-chip device. An example is a method of forming a multi-chip device. Dies are formed …

(57) ABSTRACT A method and apparatus for separating a substrate into indi vidual dies and
the resulting structure is provided. A modifi cation layer, such as an amorphous layer, is …

BACKGROUND 0002 Packaged semiconductor dies, including memory chips,
microprocessor chips, and imager chips, typically include a semiconductor die mounted on a …

BACKGROUND In the packaging of integrated circuits, semiconductor dies may be stacked
through bonding, and may be bonded to other package components such as interposers …

BACKGROUND The present invention relates to imaging devices, and, more particularly, to
image sensor units formed using stacked image sensor and processor integrated circuits …

Various exemplary embodiments provide materials and methods for flip-chip packaging
technology. The disclosed flip-chip packaging technology can use a single B-stage wafer …

0001 Integrated circuits may beformed on semiconductor wafers that are formed from
materials such as silicon. The semiconductor wafers are processed to form various elec …

BACKGROUND First-level interconnect (FLI) structures may include bulk solder interconnect
structures to couple a die with another component (eg, another die or Substrate) of an …