Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …

3D-integration is a promising technology to help combat the" Memory Wall" in future multi-
core processors. Past work has considered using 3D-stacked DRAM as a large last-level …

3D-stacked DRAM alleviates the limited memory bandwidth bottleneck that exists in modern
systems by leveraging through silicon vias (TSVs) to deliver higher external memory …

Memory bandwidth has become a major performance bottleneck as more and more cores
are integrated onto a single die, demanding more and more data from the system memory …

Three-dimensional chip (3-D) stacking technology provides a new approach to address the
so-called memory wall problem. Memory processor chip stacking reduces this memory wall …

3D multicore systems with stacked DRAM have the potential to boost system performance
significantly; however, this performance increase may cause 3D systems to exceed the …

Emerging memory technologies such as STT-RAM, PCRAM, and resistive RAM are being
explored as potential replacements to existing on-chip caches or main memories for future …

Modern computing systems suffer from the dichotomy between computation on one side,
which is performed only in the processor (and accelerators), and data storage/movement on …

3D-stacking technology has enabled the option of embedding a large DRAM onto the
processor. Prior works have proposed to use this as a DRAM cache. Because of its large …

Today's systems are overwhelmingly designed to move data to computation. This design
choice goes directly against at least three key trends in systems that cause performance …