BACKGROUND In optical transceivers, it is desirable to integrate as many photonic
components in one chip as possible. As integration density increases and the sizes of …

BACKGROUND In optical transceivers, it is desirable to integrate as many photonic
components in one chip as possible. As integration density increases and the sizes of …

BACKGROUND As computer chip speeds on circuit boards increase to ever faster speeds, a
communications bottleneck in inter-chip communication is becoming a larger problem. One …

BACKGROUND 0002 Silicon nanophotonic chips, such as in silicon on insulator (SOI)
platforms, typically include waveguide cross sections in the Sub-micron scale, are highly …

BACKGROUND Optical fibers have been widely used for the propagation of optical signals,
especially to provide high-speed commu nication links. Optical links using fiber optics …

BACKGROUND 0002. A photonic integrated circuit (PIC) based on a silicon-on-insulator
(SOI) platform is highly compact and exhibits a high level of functional integration due to its …

An optical coupler at an edge of a photonic integrated circuit (PIC) is provided and
configured to match a mode of a waveguide of the PIC to a mode of an external optical fiber …

This invention generally relates to optoelectronic inte grated circuits, or photonics chips, and
more specifically, to 15 optical coupling between a waveguide and a photonics chip …

Photonic integrated circuits (PICs) enable manipulation of light on a chip for
telecommunications and information processing. They can be made with silicon and silicon …

Provided is a connector assembly for optically connecting one or more optical fibers and an
array of vertical coupling elements of a photonic integrated circuit (PIC). In various …