Techniques and configurations for recessed semiconductor substrates
A Wu, R Chen, CC Han, SM Liou, CC Wei… - US Patent App. 13 …, 2011 - Google Patents
BACKGROUND 0003. The background description provided herein is for the purpose of
generally presenting the context of the disclo sure. Work of the presently named inventors, to …
generally presenting the context of the disclo sure. Work of the presently named inventors, to …
Device and method for localized underfill
L Wang, R Katkar, CG Woychik, CE Uzoh - US Patent 9,349,614, 2016 - Google Patents
BACKGROUND The present disclosure relates generally to packaging of integrated circuit
devices and more particularly to localizing underfill. Semiconductor devices, such as …
devices and more particularly to localizing underfill. Semiconductor devices, such as …
Package assembly having a semiconductor substrate
SM Liou, S Sutardja, A Wu, CC Cheng… - US Patent App. 12 …, 2011 - Google Patents
BACKGROUND 0003. The background description provided herein is for the purpose of
generally presenting the context of the disclo sure. Work of the presently named inventors, to …
generally presenting the context of the disclo sure. Work of the presently named inventors, to …
Packaging devices and methods
SW Liang, KC Wu, MC Ho, WU Yi-Wen - US Patent 9,030,010, 2015 - Google Patents
BACKGROUND Semiconductor devices are used in a variety of electronic applications, such
as personal computers, cellphones, digital cameras, and other electronic equipment, as …
as personal computers, cellphones, digital cameras, and other electronic equipment, as …
Methods of fabricating semiconductor die assemblies
LG England, PA Silvestri, M Koopmans - US Patent 9,711,494, 2017 - Google Patents
(54) METHODS OF FABRICATING(2013.01); HOIL 25/0657 (2013.01); HOIL
SEMCONDUCTOR DIE ASSEMBLES 25/18 (2013.01); HOIL 21/6835 (2013.01); HOIL …
SEMCONDUCTOR DIE ASSEMBLES 25/18 (2013.01); HOIL 21/6835 (2013.01); HOIL …
Edge interconnects for die stacking
D Lu, W Shi, Q Zhou, J He - US Patent App. 11/322,297, 2007 - Google Patents
(76) Inventors: g". SSo AZ 2. Wei (52) US Cl.... 257/686 i, Gilbert,; Qing Zhou, Chandler, AZ
(US); Jiangqi He,(57) ABSTRACT Gilbert, AZ (US) Electronic devices and methods for …
(US); Jiangqi He,(57) ABSTRACT Gilbert, AZ (US) Electronic devices and methods for …
Packaging devices and methods for semiconductor devices
W Hung - US Patent 9,287,194, 2016 - Google Patents
BACKGROUND Semiconductor devices are used in a variety of electronic applications, such
as personal computers, cellphones, digital cameras, and other electronic equipment, as …
as personal computers, cellphones, digital cameras, and other electronic equipment, as …
Processed stacked dies
CE Uzoh, G Gao, LW Mirkarimi… - US Patent …, 2020 - Google Patents
Representative implementations of techniques and methods include processing singulated
dies in preparation for bond ing. A plurality of semiconductor die components may be …
dies in preparation for bond ing. A plurality of semiconductor die components may be …
Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods
CHA Chen, A Gupta, R Wallingford… - US Patent …, 2011 - Google Patents
METHODS FOR SETTING UP SUCH 6,804,381 B2 10/2004 Pan et al. METHODS 6,855,381
B2 2/2005 Dietrich et al. 6,865,288 B1 3/2005 Shishido et al.(75) Inventors: Chien-Huei …
B2 2/2005 Dietrich et al. 6,865,288 B1 3/2005 Shishido et al.(75) Inventors: Chien-Huei …
Substrates Comprising Integrated Circuitry, Methods Of Processing A Substrate Comprising Integrated Circuitry, And Methods Of Back-Side Thinning A Substrate …
S Varghese, A Carswell, K Sakai… - US Patent App. 13 …, 2013 - Google Patents
BACKGROUND 0002. A through-substrate via is a vertical connection passing completely
through a Substrate comprising integrated circuitry. Through-substrate vias may be used to …
through a Substrate comprising integrated circuitry. Through-substrate vias may be used to …