Abstract For 50 years, Moore's Law has held true, the steadily increasing chip transistor
count has enabled ever more power dense high performance computing systems, but in …

Recent development in semiconductor and other other mini-and micro-scale electronic
technologies and continued miniaturization have led to very high increase in power density …

The drive for higher performance has led to greater integration and higher clock frequency of
microprocessor chips. This translates into higher heat dissipation and, therefore, effective …

We developed a unified semianalytical thermal-fluidic model for hotspot (HS) thermal
management via thin-film evaporation from well-defined silicon micropillar wicks. The …

Many advances in Complementary Metal Oxide Semiconductor (CMOS) technology (deep
sub micron feature scales, GHz frequencies, and Silicon On Insulator (SOI) fabrication) have …

Thermal emergency in integrated circuits has become an important issue with aggressive
scaling trends. Several novel cooling techniques are investigated in both academia and …

In recent years, global automotive industries are going through a significant revolution from
traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 …

The electronics packaging community strongly believes that Moore's law will continue for
another few years due to recent technological efforts to build heterogeneously integrated …

In recent years, global automotive industries are going through a significant revolution from
traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO 2 …

Demand for high performance compute systems in small form factors is at an all-time high,
with waste heat flux reaching as high as 500–1000 W/cm2 in 2023. A technology that can …