Underfill delamination jeopardy in flip chip organic packages is driven by shear and peeling
interfacial stresses, which are directly impacted by underfill fillet geometry. Finite element …

It is essential to understand the impact of packaging on chips with copper/low k structures. In
this paper, a multi-level, multi-scale modeling technique is used to study the die attach …

The increasingly severe demands of concurrently increasing die size while reducing
package size have made the mechanical stability of novel surface mount technologies a …

Abstract PoP (Package on Package) structures have been used widely in digital consumer
electronics products such as digital still cameras and mobile phones. However, the final …

The stresses occurring in the solder joints during thermal cyclic loads have been assessed
by finite element analysis and experimental tests in order to study the effect of hidden …

In this study, the interfacial fracture toughness between passivation layer and underfill was
investigated at elevated temperatures by performing conventional four-point bending test …

The chip corner geometry and the mismatch of the coefficient of thermal expansion cause a
local stress concentration in the underfill near the chip corner area. Delamination at the chip …

An innovative packaging solution-Cu-column on BOL'(CuBOL) is developed that
dramatically reduces flip chip package cost and offers superior product reliability, thus …

Chip-package interaction (CPI) has become a critical reliability issue for flip-chip packaging
of Cu/low-k chip with organic substrate. The thermo-mechanical deformation and stress …

This paper focuses on understanding the mechanisms of die and underfill cracking during
MRT (Moisture Resistance Test, JEDEC level 3) and TCT (Thermal Cycling Test,-55-125/spl …