Profile characteristics and evolution in combined laser and electrochemical machining

Y Wang, Y Yang, Y Li, F Shao… - Journal of The …, 2022 - iopscience.iop.org
Machining small holes with high efficiency and high surface quality remains a challenging
issue. Laser and shaped tube electrochemical machining (LSTEM) has been proposed to …

[HTML][HTML] Dry etching of monocrystalline silicon using a laser-induced reactive micro plasma

R Heinke, M Ehrhardt, P Lorenz, K Zimmer - Applied Surface Science …, 2021 - Elsevier
Dry etching is a prevalent technique for pattern transfer and material removal in
microelectronics, optics and photonics due to its high precision material removal with low …

Laser–material interaction and grooving performance in ultrafast laser ablation of crystalline germanium under ambient conditions

S Manickam, J Wang, C Huang - Proceedings of the …, 2013 - journals.sagepub.com
Microgrooving on crystalline germanium (Ge)< 100> surface using 1064 nm wavelength
ultrafast laser pulses under ambient condition is investigated. The interaction of laser and …

Fundamental investigation on partially overlapped nano-cutting of monocrystalline germanium

M Lai, X Zhang, F Fang, M Bi - Precision Engineering, 2017 - Elsevier
Molecular dynamics simulations on partially overlapped nano-cutting of monocrystalline
germanium with different feeds are carried out to investigate the surface topography, cutting …

Theoretical analysis of micro/nano electrochemical machining with ultra-short voltage pulses

VM Volgin, VV Lyubimov, TB Kabanova, AD Davydov - Electrochimica Acta, 2021 - Elsevier
The effect of pulse-on and pulse-off times on the efficiency of micro/nano ECM with ultra-
short voltage pulses is theoretically analyzed. A new approximate analytical equation for the …

Slicing, cleaning and kerf analysis of germanium wafers machined by wire electrical discharge machining

D Rakwal, E Bamberg - Journal of materials processing technology, 2009 - Elsevier
This paper investigates the slicing of germanium wafers from single crystal, gallium-doped
ingots using wire electrical discharge machining. Wafers with a thickness of 350μm and a …

A tool-based precision hybrid laser-electrochemical micromachining process: process analysis by multidisciplinary simulations and experiments

KK Saxena, X Chen, J Qian… - Journal of The …, 2020 - iopscience.iop.org
Hybrid laser-electrochemical micromachining is a fast and force-free processing technique
to machine difficult-to-cut multi-materials with conductivity variations and has the advantage …

Electrochemical methods of micropart's manufacturing

S Skoczypiec - Micro and Precision Manufacturing, 2018 - Springer
This chapter introduces basics of electrochemical micromachining (ECMM). In this process,
no mechanical contact between tool and workpiece occurs, and machinability is not …

Metal micro-hole formation without recast layer by laser machining and electrochemical machining

A Sun, Y Chang, H Liu - Optik, 2018 - Elsevier
Laser machining and electrochemical machining (LM-ECM) of metal micro-hole is presented
in this study. Millisecond pulsed laser etches metallic materials by thermal effect, and …

A tool-based hybrid laser-electrochemical micromachining process: Experimental investigations and synergistic effects

KK Saxena, J Qian, D Reynaerts - International Journal of Machine Tools …, 2020 - Elsevier
This paper proposes a novel tool-based hybrid laser-ECM process which exploits synergy of
laser and electrochemical process energies along the same machining axis, thereby …