The etching of high aspect ratio structures in silicon via the Bosch process is essential in
modern technologies such as microelectromechanical systems (MEMS) and through‑silicon …

The etching of high aspect ratio structures in silicon via the Bosch process is essential in
modern technologies such as microelectromechanical systems (MEMS) and through‑silicon …

High aspect ratio silicon structures have gained significant interest due to their vast
applications. Minimal lateral etch under the mask is essential to achieve such high aspect …

In dry plasma silicon etching, it is desired to have a high etching rate, a high etching
selectivity to mask material, a vertical or controllable sidewall profile, and a smooth sidewall …

We presented an innovative composite α-Si/SiO 2/Si 3 N 4/SiO 2 (α-Si/ONO) hard mask
etching technology to produce sub-30 nm ultrafine gate patterns. Effects of process …

Silicon oxide-based materials such as quartz and silica are widely used in
microelectromechanical systems (MEMS). One way to enhance the capability of their deep …

Getting high aspect ratio (HAR) structures is a frequent request in directional etching of
silicon using mainstream plasma tools. HAR features are useful either directly (eg, photonic …

This work reports the utilization of a recently developed film, ScAlN, as a silicon etch mask
offering significant improvements in high etch selectivity to silicon. Utilization of ScAlN as a …

We investigated the remote oxygen and hydrogen plasma cleaning to remove reactive ion
etching (RIE) induced fluorocarbon and polymerized residues formed during the dry etching …

Silicon structures with ultra-high aspect ratios have great potential applications in the fields
of optoelectronics and biomedicine. However, the slope and increased roughness of the …