The minimum and stability of material removal are critical determinants of the accuracy
limitations in precision engineering. This study explores electrochemically induced chemical …

Electrochemical discharge machining (ECDM) is the preferred non-traditional process
technology in recent years, The main processing is applied to machining non-conductive …

Isotropic etching polishing (IEP) based on the merging of isotropic etch pits has been
proposed as a generic metal finishing approach. In this work, the tuning of the etching …

Quartz crystals are the most widely used material in resonant sensors, owing to their
excellent piezoelectric and mechanical properties. With the development of portable and …

The gap control problem in hole-machining of Pyrex® wafer by electrochemical discharge
machining (ECDM) to obtain a smooth quality and acceptable material removal rate is …

When appraising the performance of titanium alloys for corrosion resistance in halide
environments researchers have well understood pitting and growth mechanisms through …

Spark-assisted chemical engraving (SACE) is a flexible, simple and inexpensive method for
machining electrically non-conductive materials. SACE is particularly interesting because of …

Lately, the development of micro/nano-scale devices in optics, displays, communications,
electronics, and fuel-cell industries has given rise to the advent of various micro-machining …

The micro-hole machining of quartz wafers depends on photolithography techniques akin to
those used in semiconductor fabrication. These methods present challenges due to high …

Electro-chemical machining (ECM) has been rarely applied in micro machining because the
electric field is not localized. In this work, ultra short pulses with tens of nanosecond duration …