S Habisch, M Böhme, S Peter, T Grund, P Mayr - Metals, 2018 - mdpi.com
Diffusion bonding is a well-known technology for a wide range of advanced joining applications, due to the possibility of bonding different materials within a defined …
M Joseph Fernandus, T Senthilkumar… - Journal of materials …, 2012 - Springer
The main difficulty when joining magnesium (Mg) and aluminum (Al) alloys by fusion welding lies in the formation of oxide films and brittle intermetallic in the bond region which …
M Ben-Haroush, B Mittelman, R Shneck, E Priel - Materials, 2023 - mdpi.com
Diffusion bonding experiments followed by tensile testing were conducted on cylindrical pairs of AA6061–AA1050 aluminum alloys. The influence of bonding time, atmosphere and …
The precipitation-hardenable aluminum alloy 6061 (AA 6061) is favored for aerospace components and automotive parts. However, the tenacious oxide layer on the surface …
N Kurgan - The International Journal of Advanced Manufacturing …, 2014 - Springer
In the present study, diffusion bonding of aluminium alloy (AA7075) sheet materials which are used especially in the automobile and aerospace industry has been investigated at …
Diffusion bonding is a solid state joining technique specially employed for joining dissimilar alloys. It depends heavily on optimized process conditions for quality bonding. In this study …
J Varmazyar, M Khodaei - Journal of Alloys and Compounds, 2019 - Elsevier
Diffusion bonding, due to improving the dispersion of brittle intermetallic compounds, reducing the process energy and increasing the bonding strength of aluminum-magnesium …
MJ Fernandus, T Senthilkumar, V Balasubramanian… - Materials & Design, 2012 - Elsevier
The main difficulty when joining magnesium (Mg) and aluminium (Al) alloys lies in the existence of formation of oxide films and brittle intermetallic in the bond region. However …
F Wu, W Zhou, Y Han, X Fu, Y Xu, H Hou - Materials, 2018 - mdpi.com
Three different bonding couples assembled by two commonly used aerospace aluminum alloys were bonded within the temperature range of 460–520° C under 6 MPa for 60 min in …