3D multicore systems with stacked DRAM have the potential to boost system performance
significantly; however, this performance increase may cause 3D systems to exceed the …

A 3D architecture with DRAM memory stacked on a multi-core processor has many benefits
for the embedded system. Compared with a conventional 2D design, it reduces memory …

3D-integration is a promising technology to help combat the" Memory Wall" in future multi-
core processors. Past work has considered using 3D-stacked DRAM as a large last-level …

Editor's note: From a system architecture perspective, 3D technology can satisfy the high
memory bandwidth demands that future multicore/manycore architectures require. This …

3D-stacked DRAM alleviates the limited memory bandwidth bottleneck that exists in modern
systems by leveraging through silicon vias (TSVs) to deliver higher external memory …

Memory bandwidth has become a major performance bottleneck as more and more cores
are integrated onto a single die, demanding more and more data from the system memory …

Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …

With the popularity of multi-core architecture, to sustain the memory demands from different
cores, the memory system is expected to grow significantly in both speed and capacity. This …

Technology scaling has caused the feature sizes to shrink continuously, whereas
interconnects, unlike transistors, have not followed the same trend. Designing 3D stack …

Convergence of communication, consumer applications and computing within mobile
systems pushes memory requirements both in terms of size, bandwidth and power …