3D-integration is a promising technology to help combat the" Memory Wall" in future multi-
core processors. Past work has considered using 3D-stacked DRAM as a large last-level …

Three-dimensional integration enables stacking memory directly on top of a microprocessor,
thereby significantly reducing wire delay between the two. Previous studies have examined …

A promising recent development that can provide continued scaling of performance is the
ability to stack multiple DRAM layers on a multi-core processor die. This paper analyzes the …

3D-stacking technology has enabled the option of embedding a large DRAM onto the
processor. Prior works have proposed to use this as a DRAM cache. Because of its large …

This paper concerns appropriate 3D DRAM architecture design and the potential of using
3D DRAM to implement both L2 cache and main memory in 3D multi-core processor-DRAM …

Memory bandwidth has become a major performance bottleneck as more and more cores
are integrated onto a single die, demanding more and more data from the system memory …

3D-stacked DRAM alleviates the limited memory bandwidth bottleneck that exists in modern
systems by leveraging through silicon vias (TSVs) to deliver higher external memory …

Editor's note: From a system architecture perspective, 3D technology can satisfy the high
memory bandwidth demands that future multicore/manycore architectures require. This …

On-chip DRAM caches may alleviate the memory bandwidth problem in future multi-core
architectures through reducing off-chip accesses via increased cache capacity. For memory …

DRAM caches have shown excellent potential in capturing the spatial and temporal data
locality of applications capitalizing on advances of 3D-stacking technology; however, they …