The mechanical properties of simple metals in small dimensions have been the objects of
many studies. Average stress measurements clearly show that yield stress increases …

In this review article we consider the crack growth resistance of micrometer and sub-
micrometer sized samples from the fracture mechanics point of view. Standard fracture …

In a flip chip package, the chip corner areas which are embedded in the underfill material
are often critical to the damage initiation, since a stress concentration usually exists at these …

In situ investigations of cracks propagating at up to 2.5 km s− 1 along an (001) plane of a
silicon single crystal are reported, using X-ray diffraction megahertz imaging with intense …

During the past decade, there has been a rapid development in microfabrication technology
driven by the market need for low-cost consumer products, such as portable …

The effect of moisture and aqueous solution chemistry on the rate of crack growth in
lithographically patterned arrays of copper and low dielectric constant (LKD) materials is …

X-ray topography is a powerful method for analyzing crystal defects and strain in crystalline
materials non-destructively. However, conventional X-ray topography uses simple X-ray …

The influence of a notch and a water environment on the quasi‐static and fatigue fracture
behaviour was investigated in single crystal silicon microelements. The tests were …

The technologies developed for macroscale testing are not necessarily applicable to
evaluate the mechanical properties of structures with dimensions comparable to those of …

Anisotropic crack patterns emerging in desiccating layers of pastes on a substrate can be
exploited for controlled cracking with potential applications in microelectronic manufacturing …