Fhis paper discusses the extensive development work carried out by GLOBALFOUNDRIES
to mitigate chip-package interaction (CPI) risks for the silicon Backend of Line (BEOL) during …

This paper describes a systematic approach to the identification of primary contributing
factors to the Chip Package Interaction (CPI) risk and reveals the mitigation strategy …

Chip Package Interaction (CPI) is a widely recognized quality and reliability challenge for flip-
chip packages due to the ultra low-K materials used within the silicon Back End of Line …

Ultra-high density chips are required for higher device performance, lower power
consumption and a smaller form factor device. The interconnection between the chip and …

The need for high performance and multi-functional devices drove silicon manufacturers to
introduce ultra-low dielectric constant (ULK) materials into the back-end-of-line (BEOL) of …

For mobile applications, advanced silicon technology nodes are using Back End Of Line
(BEOL) stacks with Ultra Low-k (ULK) materials. Employing these ULK materials in …

Chip packaging interaction (CPI) has drawn great attention to advanced silicon technology
nodes due to the introduction of Low-K (LK) and Ultra Low-K (ULK) materials in back end of …

Ultra low-k (ULK, k= 2.4) dielectric has weaker mechanical properties than first generation
low-k films (k= 3.0). The introduction of ULK into advanced back end of lines (BEOL) …

To enable higher computing power in a single chip, there is demand for increasing die size
for high performance applications in advanced nodes. Due to the weak mechanical …

As Cu bump is widely adopted in microelectronic IC product packages for broader scope of
applications throughout network communication and handheld device, it impacts on the …