With the growth of electronic packaging industries, ranging from automobiles to hand-held
products, reliability is a major concern. Also, to keep pace with the increasing demand of …

With the growth of electronic packaging industries, ranging from automobile to hand-held
products, reliability is a major concern. Also, to keep pace with the increasing demand of …

Solder joints provide mechanical support, and electrical and thermal interconnection among
various packaging levels in microelectronics assemblies. Reliability of electronic packages …

The elimination of lead from electronics due to its detrimental effects to environment and
health is pushing component manufacturers to consider lead free solder alloys as the …

Lead-free solder joints are the most extensively used interconnects in electronic packaging
industries. Most of the lead-free solder alloys (SAC) are composed of β-Sn, Ag, and Cu. To …

The elimination of lead from electronics due to its detrimental effects to environment is
pushing component manufacturers to consider lead free solder alloy as an option …

The Anand viscoplastic constitutive model is commonly used to represent the rate-
dependent deformation behavior of lead-free solder materials. This model is characterized …

Solder joints provide mechanical support, and electrical and thermal interconnection among
various packaging levels in microelectronics assemblies. Reliability of electronic packages …

The mechanical properties of a lead free solder are strongly influenced by its microstructure,
which is controlled by its thermal history including solidification rate and thermal aging after …

Motivated by our desire to understand and improve the mechanical reliability of solder joints
in integrated circuits, we used instrumented indentation to measure the Young's modulus (E) …