BACKGROUND 0002 Integrated circuits can be designed using different technologies, for
example complementary metal oxide semi conductor (CMOS) technology, glass technology …

BACKGROUND Semiconductor devices are used in a variety of electronic applications, such
as personal computers, cell phones, digi tal cameras, and other electronic equipment, as …

BACKGROUND Stacked die ICs may be formed from different interposer dies (“interposers').
These interposers may have different sizes and accommodate different types and/or …

BACKGROUND [0002] In the fabrication of electronic apparatuses, the stacking of multiple
dies has become popular because of advantages in reducing the physical space of a …

BACKGROUND Stacked ICs increase device functionality and decrease occupied area by
stacking dies vertically. In stacked ICs, a second die is stacked on a first die allowing …

BACKGROUND [0003] The electronics industry has continued to face an ever-increasing
demand for faster and more powerful pro cessing capacity, as well as increased storage …

BACKGROUND Since the invention of the integrated circuit, the semicon ductor industry has
experienced rapid growth due to continu ous improvements in the integration density of a …

BACKGROUND The present disclosure generally relates to the field of electronics. More
particularly, an embodiment of the inven tion relates to die backside wire bond technology. A …

BACKGROUND The probability that a flaw will occur in a die when manu facturing an
integrated circuit (IC) generally increases as the size of the die used to implement the IC …

BACKGROUND In the packaging of integrated circuits, dies may be pack aged onto a
package Substrate (sometimes referred to as a laminate Substrate), which includes metal …