Editor's note: From a system architecture perspective, 3D technology can satisfy the high
memory bandwidth demands that future multicore/manycore architectures require. This …

This paper concerns appropriate 3D DRAM architecture design and the potential of using
3D DRAM to implement both L2 cache and main memory in 3D multi-core processor-DRAM …

Emerging 3D die-stacked DRAM technology is one of the most promising solutions for future
memory architectures to satisfy the ever-increasing demands on performance, power, and …

3D integration based on TSV (through silicon via) technology enables stacking of multiple
memory layers and has the advantage of higher bandwidth at lower energy consumption for …

WIDE I/O DRAM is a promising 3-D memory architecture for low-power/highperformance
computing. This paper proposes a new WIDE I/O DRAM architecture to reduce access …

This paper presents an innovative memory management approach to utilize both 3D-DRAM
and external DRAM (ex-DRAM). Our approach dynamically allocates and relocates memory …

Motivated by increasingly promising three-dimensional (3D) integration technologies, this
paper reports an architecture design of 3D integrated dynamic RAM (DRAM). To …

Three-dimensional (3D) on-chip memory stacking has been proposed as a promising
solution to the “memory wall” challenge with the benefits of low access latency, high data …

Historically, processor performance has increased at a much faster rate than that of main
memory and up-coming NoC-based many-core architectures are further tightening the …

3D-integration is a promising technology to help combat the" Memory Wall" in future multi-
core processors. Past work has considered using 3D-stacked DRAM as a large last-level …