J Hoople, J Kuo, JSB Woon, N Singh… - 2015 IEEE International …, 2015 - ieeexplore.ieee.org
In this paper we present designs of an aluminum nitride (AlN) based transducer stack for ultrasonic transmit/receive applications integrated in silicon. By optimal design of the …
J Hoople, J Kuo, S Ardanuç… - 2014 IEEE International …, 2014 - ieeexplore.ieee.org
As CMOS electronics scale to smaller dimensions, wired interconnect density, power consumption, and delays have introduced bottlenecks in performance. Ultrasonic …
J Kuo, J Hoople, S Ardanuç… - 2014 IEEE International …, 2014 - ieeexplore.ieee.org
3D interconnects between stacked silicon chips in 3D integrated circuits (3DICs) have been realized with through-silicon vias (TSVs). These call for special processing microfabriation …
M Abdelmejeed, A Ravi, Y Liu, J Kuo… - 2019 IEEE …, 2019 - ieeexplore.ieee.org
For the first time we demonstrate monolithically integrated solidly mounted piezoelectric AlN (aluminum nitride) thin film transducers integrated onto 180nm CMOS wafers to realize …
J Kuo, J Hoople, A Lal - 2015 IEEE International Ultrasonics …, 2015 - ieeexplore.ieee.org
In this paper, we present the concept and demonstrate the use of recirculating ultrasonic pulses as memory elements, stored in the thickness of a silicon wafer. This memory can be …
CH Cheng, EM Chow, X Jin, S Ergun… - … Symposium (Cat. No …, 2000 - ieeexplore.ieee.org
This paper presents a technology for high density and low parasitic capacitance electrical interconnects to arrays of Capacitive Micromachined Ultrasonic Transducers (CMUTs) on a …
Low frequency ultrasonic transducers arrays are gaining interest, with new applications such as ultrasonic powering, ultrasound imaging, tactile displays and ultrasonic haptic feedback …
V Vasudevan, P Govindan… - … Conference on Electro …, 2014 - ieeexplore.ieee.org
This study presents a scheme for enhancing the capabilities of an ultrasonic hardware platform leading to a fully reconfigurable system allowing for dynamic control over the …
M Abdelmejeed, JC Kuo, A Lal - 2018 IEEE International …, 2018 - ieeexplore.ieee.org
In this paper a Digital to Analog Converter (DAC) based on the propagation of ultrasonic waves in silicon is presented. AlN piezoelectric transducers on a silicon substrate are used …