On-chip wired interconnects presents a bottleneck for VLSI integrated circuits. An additional
channel with which to communicate information would be beneficial to supplement …

In this paper we present designs of an aluminum nitride (AlN) based transducer stack for
ultrasonic transmit/receive applications integrated in silicon. By optimal design of the …

As CMOS electronics scale to smaller dimensions, wired interconnect density, power
consumption, and delays have introduced bottlenecks in performance. Ultrasonic …

3D interconnects between stacked silicon chips in 3D integrated circuits (3DICs) have been
realized with through-silicon vias (TSVs). These call for special processing microfabriation …

For the first time we demonstrate monolithically integrated solidly mounted piezoelectric AlN
(aluminum nitride) thin film transducers integrated onto 180nm CMOS wafers to realize …

In this paper, we present the concept and demonstrate the use of recirculating ultrasonic
pulses as memory elements, stored in the thickness of a silicon wafer. This memory can be …

This paper presents a technology for high density and low parasitic capacitance electrical
interconnects to arrays of Capacitive Micromachined Ultrasonic Transducers (CMUTs) on a …

Low frequency ultrasonic transducers arrays are gaining interest, with new applications such
as ultrasonic powering, ultrasound imaging, tactile displays and ultrasonic haptic feedback …

This study presents a scheme for enhancing the capabilities of an ultrasonic hardware
platform leading to a fully reconfigurable system allowing for dynamic control over the …

In this paper a Digital to Analog Converter (DAC) based on the propagation of ultrasonic
waves in silicon is presented. AlN piezoelectric transducers on a silicon substrate are used …