T Gong, Y Wu, L Gao, L Zhang, J Li, T Ming - Energy, 2019 - Elsevier
Thermoelectric cooler (TEC) is a solid-state component that utilizes Peltier effect to dissipate the heat of the electronic packaging system. It shows unique advantages over conventional …
This paper presents a novel general single/multi-parameter optimization model for the thermoelectric cooler (TEC) based on the 1D resistance method, which precisely captures …
J Zhang, H Zhao, B Feng, X Song, X Zhang… - International Journal of …, 2023 - Elsevier
In this article, the geometric optimum design of a thermoelectric cooler (TEC) is simulated by Finite Element Analysis. We studied the influence of the geometric structure on TEC …
T Lu, Y Li, J Zhang, P Ning, P Niu - Energies, 2020 - mdpi.com
In this study, a full-scale three-dimensional trapezoidal thermoelectric cooler model is constructed to study its cooling performance and mechanical reliability using finite element …
T Gong, L Gao, Y Wu, L Zhang, S Yin, J Li… - Applied Thermal …, 2019 - Elsevier
Nowadays electronic devices' increasing in power density and shrinking in size make it hard to remove the heat. The resulting uneven energy dissipation and high local heat flux density …
J Hao, H Qiu, J Ren, Z Ge, Q Chen, X Du - Energy, 2020 - Elsevier
Performance improvement of the thermoelectric cooler depending on both the thermoelectric material development and the system design optimization will be positive and significant for …
J Yang, J Han, X Zhu, Y Ge, W Zhu - International Journal of Refrigeration, 2023 - Elsevier
In this paper, a new thermal management method applied to thermoelectric cooler (TEC) is proposed by combining radiative sky cooler (RSC) with air cooling, which can improve …
The present study aims to investigate the performance of a one-stage thermoelectric cooler using mathematical and thermodynamic modeling and proposing a new correlation for …
S Fan, A Rezania, Y Gao - Applied Thermal Engineering, 2022 - Elsevier
Thermoelectric cooling is an attractive technology to achieve active thermal management of electronic devices, integrated circuits and micro-motor mechanism. Time-varying and …