The damage introduced into an InGaAs/InGaAsP quantum well structure during CH4/H2 reactive ion etching (RIE) processes was measured, for plasma powers from 20 W to 100 W …
The damage introduced into an InGaAs/InGaAsP quantum well structure during CH4/H2 reactive ion etching (RIE) processes was measured, for plasma powers from 20 W to 100 W …
The damage introduced into an InGaAs/InGaAsP quantum well structure during CH4/H2 reactive ion etching (RIE) processes was measured, for plasma powers from 20 W to 100 W …