Surface energetic-based analytical filling time model for flip-chip underfill process

FC Ng, MA Abas - Soldering & Surface Mount Technology, 2021 - emerald.com
Purpose This paper aims to present new analytical model for the filling times prediction in
flip-chip underfill encapsulation process that is based on the surface energetic for post-bump …
被引用次数：4 相关文章

Surface energetic-based analytical filling time model for flip-chip underfill process

FC Ng, MA Abas - Soldering & Surface Mount Technology, 2021 - ingentaconnect.com
Purpose This paper aims to present new analytical model for the filling times prediction in
flip-chip underfill encapsulation process that is based on the surface energetic for post-bump …