System in package (SiP) technology: fundamentals, design and applications

F Santagata, J Sun, E Iervolino, H Yu… - Microelectronics …, 2018 - emerald.com
Purpose The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP)
approach. This new packaging approach is based on stacked silicon submount technology …
被引用次数：18 相关文章

System in package (SiP) technology: Fundamentals, design and applications

F Santagata, J Sun, E Iervolino, H Yu… - Microelectronics …, 2018 - research.tudelft.nl
Purpose: The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP)
approach. This new packaging approach is based on stacked silicon submount technology …

System in package (SiP) technology: fundamentals, design and applications

F Santagata, J Sun, E Iervolino, H Yu… - Microelectronics …, 2018 - emerald.com
Purpose The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP)
approach. This new packaging approach is based on stacked silicon submount technology …

[引用][C] System in package (SiP) technology: fundamentals, design and applications

F Santagata, J Sun, E Iervolino, H Yu… - Microelectronics …, 2018 - ingentaconnect.com
Purpose The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP)
approach. This new packaging approach is based on stacked silicon submount technology …