Processor design in 3D die-stacking technologies
Three-dimensional integration is an emerging fabrication technology that vertically stacks
multiple integrated chips. The benefits include an increase in device density; much greater …
multiple integrated chips. The benefits include an increase in device density; much greater …
[PDF][PDF] PROCESSOR DESIGN IN 3D DIE-STACKING TECHNOLOGIES
GH Loh, Y Xie, B Black - Citeseer
...... Three-dimensional integration is an emerging fabrication technology that vertically
stacks multiple integrated chips. The benefits include an increase in device density; much …
stacks multiple integrated chips. The benefits include an increase in device density; much …
Processor Design in 3D Die-Stacking Technologies
GH Loh, Y Xie, B Black - IEEE Micro, 2007 - computer.org
Three-dimensional die-stacking integration stacks multiple layers of processed silicon with a
very high-density, low-latency layer-to-layer interconnect. After presenting a brief …
very high-density, low-latency layer-to-layer interconnect. After presenting a brief …
[PDF][PDF] PROCESSOR DESIGN IN 3D DIE-STACKING TECHNOLOGIES
GH Loh, Y Xie, B Black - scholar.archive.org
...... Three-dimensional integration is an emerging fabrication technology that vertically
stacks multiple integrated chips. The benefits include an increase in device density; much …
stacks multiple integrated chips. The benefits include an increase in device density; much …
[引用][C] Processor Design in 3D Die-Stacking Technologies
GH LOH - IEEE MICRO Magazine, 2007 - cir.nii.ac.jp
Processor Design in 3D Die-Stacking Technologies
GH Loh, Y Xie, B Black - IEEE Micro, 2007 - dl.acm.org
Three-dimensional die-stacking integration stacks multiple layers of processed silicon with a
very high-density, low-latency layer-to-layer interconnect. After presenting a brief …
very high-density, low-latency layer-to-layer interconnect. After presenting a brief …
Processor Design in 3D Die-Stacking Technologies
GH Loh, Y Xie, B Black - IEEE Micro, 2007 - infona.pl
Three-dimensional integration is an emerging fabrication technology that vertically stacks
multiple integrated chips. The benefits include an increase in device density; much greater …
multiple integrated chips. The benefits include an increase in device density; much greater …
[PDF][PDF] PROCESSOR DESIGN IN 3D DIE-STACKING TECHNOLOGIES
GH Loh, Y Xie, B Black - pages.cs.wisc.edu
...... Three-dimensional integration is an emerging fabrication technology that vertically
stacks multiple integrated chips. The benefits include an increase in device density; much …
stacks multiple integrated chips. The benefits include an increase in device density; much …
[引用][C] Processor Design in 3D Die-Stacking Technologies
GH Loh, Y Xie, B Black - IEEE Micro, 2007 - cir.nii.ac.jp
Processor Design in 3D Die-Stacking Technologies | CiNii Research CiNii 国立情報学研究所
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学術情報ナビゲータ[サイニィ] 詳細へ移動 検索フォームへ移動 論文・データをさがす 大学 …