Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products

H Shi, T Ueda - … on Electronic Packaging Technology and High …, 2011 - ieeexplore.ieee.org
This paper discusses the influences of various underfills and adhesives on board-level bend
performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the …
被引用次数：12 相关文章

Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products

H Shi, T Ueda - … and High Density Packaging, ICEPT-HDP …, 2011 - waseda.elsevierpure.com
抄録 This paper discusses the influences of various underfills and adhesives on board-level
bend performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an …

Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products

H Shi, T Ueda - 2011 - hero.epa.gov
This paper discusses the influences of various underfills and adhesives on board-level bend
performance of ChipArray (R) Thin Core Ball Grid Array (CTBGA) assemblies through an the …

Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products

H Shi, T Ueda - 2011 12th International Conference on Electronic … - infona.pl
This paper discusses the influences of various underfills and adhesives on board-level bend
performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the …

Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products

H Shi, T Ueda - … and High Density Packaging, ICEPT-HDP …, 2011 - waseda.elsevierpure.com
This paper discusses the influences of various underfills and adhesives on board-level bend
performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the …