Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
R Kandasamy, AS Mujumdar - Microelectronics Reliability, 2008 - Elsevier
The function of an electronic cooling package is to dissipate heat to ensure proper operation
and reliability. The flip chip ball grid array package is probably the most suitable package for …
and reliability. The flip chip ball grid array package is probably the most suitable package for …
Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
R Kandasamy, AS Mujumdar - Microelectronics Reliability, 2008 - infona.pl
The function of an electronic cooling package is to dissipate heat to ensure proper operation
and reliability. The flip chip ball grid array package is probably the most suitable package for …
and reliability. The flip chip ball grid array package is probably the most suitable package for …
[引用][C] Thermal analysis of a flip chip ceramic ball grid array (CBGA) package.
R Kandasamy, AS Mujumdar - Microelectronics reliability, 2008 - dialnet.unirioja.es
Thermal analysis of a flip chip ceramic ball grid array (CBGA) package. - Dialnet Ayuda ¿En
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[引用][C] Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
R KANDASAMY… - Microelectronics and …, 2008 - pascal-francis.inist.fr
Thermal analysis of a flip chip ceramic ball grid array (CBGA) package CNRS Inist Pascal-Francis
CNRS Pascal and Francis Bibliographic Databases Simple search Advanced search Search …
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Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
R Kandasamy, AS Mujumdar - Microelectronics Reliability, 2008 - ui.adsabs.harvard.edu
The function of an electronic cooling package is to dissipate heat to ensure proper operation
and reliability. The flip chip ball grid array package is probably the most suitable package for …
and reliability. The flip chip ball grid array package is probably the most suitable package for …
Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
R Kandasamy, AS Mujumdar - Microelectronics Reliability, 2008 - infona.pl
The function of an electronic cooling package is to dissipate heat to ensure proper operation
and reliability. The flip chip ball grid array package is probably the most suitable package for …
and reliability. The flip chip ball grid array package is probably the most suitable package for …