Design and characterization of high temperature packaging for wide-bandgap semiconductor devices

B Grummel - 2012 - stars.library.ucf.edu
Advances in wide-bandgap semiconductor devices have increased the allowable operating
temperature of power electronic systems. High-temperature devices can benefit applications …
被引用次数：5 相关文章
[PDF] flvc.org

[PDF][PDF] Design And Characterization Of High Temperature Packaging For Wide-bandgap Semiconductor Devices

B Grummel - purl.flvc.org
Advances in wide-bandgap semiconductor devices have increased the allowable operating
temperature of power electronic systems. High-temperature devices can benefit applications …
[PDF] ucf.edu

[PDF][PDF] DESIGN AND CHARACTERIZATION OF HIGH-TEMPERATURE PACKAGING FOR WIDE-BANDGAP SEMICONDUCTOR DEVICES

BJ GRUMMEL - 2012 - stars.library.ucf.edu
Advances in wide-bandgap semiconductor devices have increased the allowable operating
temperature of power electronic systems. High-temperature devices can benefit applications …
[PDF] flvc.org

[PDF][PDF] DESIGN AND CHARACTERIZATION OF HIGH-TEMPERATURE PACKAGING FOR WIDE-BANDGAP SEMICONDUCTOR DEVICES

BJ GRUMMEL - 2012 - ucf.digital.flvc.org
Advances in wide-bandgap semiconductor devices have increased the allowable operating
temperature of power electronic systems. High-temperature devices can benefit applications …
[PDF] flvc.org

[PDF][PDF] DESIGN AND CHARACTERIZATION OF HIGH-TEMPERATURE PACKAGING FOR WIDE-BANDGAP SEMICONDUCTOR DEVICES

BJ GRUMMEL - 2012 - ucf.digital.flvc.org
Advances in wide-bandgap semiconductor devices have increased the allowable operating
temperature of power electronic systems. High-temperature devices can benefit applications …