Prediction of filling time in capillary-driven underfill process through 3D numerical analysis

K Wang, Y Wang, W Zhu - 2018 19th International Conference …, 2018 - ieeexplore.ieee.org
Underfill, mainly composed of epoxy resin and silica fillers, is used to fill the standoff gap in
flip chip to alleviate stress and prevent the solder bumps from crack and fatigue fracture. In …
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[PDF] researchgate.net

[PDF][PDF] Prediction of filling time in capillary-driven underfill process through 3D numerical analysis

K Wang, Y Wang, W Zhu - researchgate.net
Underfill, mainly composed of epoxy resin and silica fillers, is used to fill the standoff gap in
flip chip to alleviate stress and prevent the solder bumps from crack and fatigue fracture. In …