Finite volume method study on contact line jump phenomena and dynamic contact angle of underfill flow in flip-chip of various bump pitches
Three distinct flip-chip underfill cases were considered in this work, with each possess a
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …
Finite Volume Method Study on Contact Line Jump Phenomena and Dynamic Contact Angle of Underfill Flow in Flip-Chip of Various Bump Pitches
FC Ng, A Abas, MZ Abdullah - Materials Science and …, 2019 - ui.adsabs.harvard.edu
Three distinct flip-chip underfill cases were considered in this work, with each possess a
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …
[PDF][PDF] Finite Volume Method Study on Contact Line Jump Phenomena and Dynamic Contact Angle of Underfill Flow in Flip-Chip of Various Bump Pitches
FC Ng, A Abas, MZ Abdullah - researchgate.net
Three distinct flip-chip underfill cases were considered in this work, with each possess a
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …
Finite Volume Method Study on Contact Line Jump Phenomena and Dynamic Contact Angle of Underfill Flow in Flip-Chip of Various Bump Pitches
FC Ng, A Abas, MZ Abdullah - IOP Conference Series …, 2019 - search.proquest.com
Three distinct flip-chip underfill cases were considered in this work, with each possess a
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …
bump pitch of 0.8 mm, 1.0 mm and 1.2 mm. Contact line jump (CLJ) phenomenon during the …