A novel model for simulating the racing effect in capillary-driven underfill process in flip chip
W Zhu, K Wang, Y Wang - Journal of Micromechanics and …, 2018 - iopscience.iop.org
Underfill is typically applied in flip chips to increase the reliability of the electronic
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …
A novel model for simulating the racing effect in capillary-driven underfill process in flip chip
W Zhu, K Wang, Y Wang - Journal of Micromechanics and …, 2018 - inis.iaea.org
[en] Underfill is typically applied in flip chips to increase the reliability of the electronic
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …
A novel model for simulating the racing effect in capillary-driven underfill process in flip chip
W Zhu, K Wang, Y Wang - Journal of Micromechanics and …, 2018 - ui.adsabs.harvard.edu
Underfill is typically applied in flip chips to increase the reliability of the electronic
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …
packagings. In this paper, the evolution of the melt-front shape of the capillary-driven …