Reliability of die attach on DBC substrates with different Ni surface finishes using BiAgX solder
J Cui, RW Johnson, MC Hamilton - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Ni plating is a commonly used barrier layer for direct bond copper substrates used in high-
temperature and high-power applications. The Ni plating method can be electrolytic or …
temperature and high-power applications. The Ni plating method can be electrolytic or …
Reliability of Die Attach on DBC Substrates With Different Ni Surface Finishes Using BiAgX Solder
J Cui, RW Johnson, MC Hamilton - IEEE Transactions on Components …, 2017 - infona.pl
Ni plating is a commonly used barrier layer for direct bond copper substrates used in high-
temperature and high-power applications. The Ni plating method can be electrolytic or …
temperature and high-power applications. The Ni plating method can be electrolytic or …