2D materials in the BEOL

CH Naylor, K Maxey, C Jezewski… - … IEEE Symposium on …, 2023 - ieeexplore.ieee.org
… 300 mm BEOL compatible growth methods for 2D materials. We reveal the ultra-scaling of
interconnect barriers with a 10 Å 2D BEOL … Furthermore, we present a novel BEOL passivation …

Scalable BEOL compatible 2D tungsten diselenide

A Kozhakhmetov, JR Nasr, F Zhang, K Xu… - … Materials, 2019 - iopscience.iop.org
… electronic-grade 2D materials [14–17]. However, materials processed at the BEOL level are
… Instead, one can consider BEOL as a complementary focus area, where 2D semiconductors …

[HTML][HTML] Guest Editorial: Dimensional Scaling of Material Functional Properties to Meet Back-End-of-Line (BEOL) Challenges

S Rakheja, Z Chen, CT Chen - Applied Physics Letters, 2023 - pubs.aip.org
… Importantly, the results presented in this paper can provide physical insight into the fundamental
limits of contact engineering for 2D materials and can guide experimental investigations …

BEOL compatible 2D layered materials as ultra-thin diffusion barriers for Cu interconnect technology

CL Lo, S Zhang, T Shen… - 2017 75th Annual …, 2017 - ieeexplore.ieee.org
… scattering with the presence of 2D barriers. Directly grown graphene by … Conclusion: In
summary, 2D materials are demonstrated as … of 2D materials with the standard BEOL processes. …

[HTML][HTML] How good are 2D transistors? An application-specific benchmarking study

H Abuzaid, NX Williams, AD Franklin - Applied Physics Letters, 2021 - pubs.aip.org
BEOL) 3D-integrated FETs, and low-cost thin-film FETs (or TFTs) each demonstrated. We find
that 2D materials … crystalline quality of 2D materials grown directly onto the BEOL layers, as …

WS2 transistors on 300 mm wafers with BEOL compatibility

T Schram, Q Smets, B Groven… - 2017 47th European …, 2017 - ieeexplore.ieee.org
… The introduction of 2D materials also allows to include transistor functionality in the BEOL
(fig.1). The planar nature of 2D materials facilitates the BEOL integration over the front end …

[HTML][HTML] Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

CL Lo, BA Helfrecht, Y He, DM Guzman… - Journal of Applied …, 2020 - pubs.aip.org
… The adhesion property is the most critical factor to determine whether a 2D material can
be adopted in the BEOL technology. The weak van der Waals layer-to-layer interaction in …

Thermal stability of monolayer WS2 in BEOL conditions

S Pace, M Ferrera, D Convertino… - … of Physics: Materials, 2021 - iopscience.iop.org
… These conditions were chosen to be as close as possible to those at which 2D materials
are usually exposed during device fabrication steps [50, 51], ie dielectric deposition, metal …

Low-thermal-budget BEOL-compatible beyond-silicon transistor technologies for future monolithic-3D compute and memory applications

A Thean, SH Tsai, CK Chen, M Sivan… - 2022 International …, 2022 - ieeexplore.ieee.org
… : Oxide Semiconductor and 2D Materials for M3D integration. … our investigation of the 2D
material opportunities for 3D memories… -material integration as well as low-temperature material

Ultimate monolithic-3D integration with 2D materials: rationale, prospects, and challenges

J Jiang, K Parto, W Cao… - IEEE Journal of the …, 2019 - ieeexplore.ieee.org
… , BEOL layer and interlayer dielectric (ILD) layer. Monolithic inter-tier-via (MIV) connects
adjacent tiers and has similar diameters as vias in the BEOL … budget causes BEOL degradation, …