enable growth of commercial SiC power device applications in areas such as inverters for
photo-voltaic systems and power supplies. Recent work has achieved very low epitaxy
surface roughness and very low BPD (Basal plane dislocation) in the on 4 degree off-axis
substrates. In this paper, we report characterization of the very low BPD epitaxy wafers and a
newly observed triangular defect.