which operates between 3.1 and 10.6 GHz is presented in this article. The proposed design
is accomplished by using multilayer microstrip structure, which is formed by three layers of
conductor and two layers of substrate. The top and bottom layers consist of an octagon‐
shaped microstrip lines and an octagon‐shaped slot in the middle layer. The design was
fabricated on Rogers RO4003c substrate. Both of the simulation and measurement results …