Accurate modeling of forced convection cooling for microelectronic packages: Numerical and experimental thermal studies

MK Toure, PM Souare, B Foisy… - 2019 18th IEEE …, 2019 - ieeexplore.ieee.org
MK Toure, PM Souare, B Foisy, E Duchesne, J Sylvestre
2019 18th IEEE Intersociety Conference on Thermal and …, 2019ieeexplore.ieee.org
A bidirectional solid/fluid coupling methodology developed for natural convection [1],[2] has
been applied to the case of forced convection. The two-way coupling methodology is
compared when using CFD and empirical formulas to determine the heat transfer coefficient
at the solid/fluid interface. The numerical results are validated by experimental
measurements made according to JESD51-6 standards. The experimental tests employed
for the validation are carried out with a wind tunnel which complies with JEDEC standards …
A bidirectional solid/fluid coupling methodology developed for natural convection [1], [2] has been applied to the case of forced convection. The two-way coupling methodology is compared when using CFD and empirical formulas to determine the heat transfer coefficient at the solid/fluid interface. The numerical results are validated by experimental measurements made according to JESD51-6 standards. The experimental tests employed for the validation are carried out with a wind tunnel which complies with JEDEC standards. The results of the numerical simulations using CFD are in agreement with the experimental measurements of the junction temperature for a range of speeds between 0.5m/s and 4.5m/s and a power of 15W, while the empirical formulas lead to higher errors.
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