The implementation of fully three‐dimensional (3D) substrate integrated waveguide (SIW)
components by using an additive manufacturing technique is demonstrated for the first time.
In particular, a 3D printing process based on the t‐glase filament has been adopted. 3D
printing allows for the manufacturing of very complex shapes in a few hours, thus leading to
a one‐day prototyping time for microwave components. To characterise the electromagnetic
properties of the 3D printed material, a microstrip lines technique has been adopted. To fully …

This paper presents the recent advances in the implementation of substrate integrated
waveguide (SIW) components and circuits by additive manufacturing (AM) techniques. The
use of AM allows introducing novel features in the design of SIW structures, ranging from
fully three-dimensional geometries (impossibly to obtain with standard planar circuits
technologies), to the local modification of the dielectric permittivity and loss tangent of the 3D-
printed material (which allows for novel classes of components and resonant cavities with …