We discuss the selection criteria for alternative metals in order to fulfill the requirements
necessary for interconnects at half pitch values below 10 nm. The performance of scaled
interconnects using transition metal germanides and CoAl alloys as metallization are
studied and compared to conventional Cu and W interconnects.

Concerns about the extendibility of copper as an interconnect conductor for future
technology nodes have resulted in increasing interest in alternative conductor metals. 1 With
ever-decreasing interconnect dimensions, alternative metals bring hope of improved
resistivity and reliability through more favorable electron scattering and cohesive energy and
the possibility of improved scaling through barrier layer removal. 2, 3 Cobalt, in particular,
has been the subject of several recent studies and has already found its way into at least …