technology nodes. In this work, atomic layer deposition (ALD) was used to deposit thin films
of RuO 2 on SiO 2 using bis-(ethylcyclopentadienyl)-ruthenium [Ru (EtCp) 2] as the
precursor and oxygen (O 2) plasma as the reducing agent. The thermal stability of the
deposited films were investigated in the N 2 ambient and in the forming-gas environments
using rapid thermal processing (RTP). High-resolution transmission electron microscope …