Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires
E Hug, N Bellido - Materials Science and Engineering: A, 2011 - Elsevier
E Hug, N Bellido
Materials Science and Engineering: A, 2011•ElsevierHeat treatments performed on copper-clad aluminium thin wires increase the ductility of
copper and aluminium but activate diffusion between both layers, creating brittle
intermetallic compounds. Ductility reaches a maximum for an optimal intermetallic thickness
related to appropriate annealing conditions in order to avoid Kirkendall void formation
assisted by stress gradients.
copper and aluminium but activate diffusion between both layers, creating brittle
intermetallic compounds. Ductility reaches a maximum for an optimal intermetallic thickness
related to appropriate annealing conditions in order to avoid Kirkendall void formation
assisted by stress gradients.
Abstract
Heat treatments performed on copper-clad aluminium thin wires increase the ductility of copper and aluminium but activate diffusion between both layers, creating brittle intermetallic compounds. Ductility reaches a maximum for an optimal intermetallic thickness related to appropriate annealing conditions in order to avoid Kirkendall void formation assisted by stress gradients.
Elsevier