A deep submicron CMOS process compatible suspending high-Q inductor

CH Chen, YK Fang, CW Yang… - IEEE Electron Device …, 2001 - ieeexplore.ieee.org
chip spiral inductor. The suspending inductor employs the air gap [1] and is supported by a
set of novel metal pillars … , thus making this area useless for building MOS devices [5]. In this …

A ground-based work of droplet deposition manufacturing toward microgravity: Fine pileup of horizontally ejected metal droplets on vertical substrates

J Huang, L Qi, J Luo, K Zhang, L Yang - Journal of Manufacturing …, 2021 - Elsevier
… cross-section structure provides enough rigidity to support the … of pillar structure (regarded
as simplest building block) by … a vertical substrate by building a fin-chip array structure. On this …

Reusable support for additive manufacturing

Y Xu, Z Wang, S Gong, Y Chen - Additive Manufacturing, 2021 - Elsevier
… like pillars are generated to support the branch-like supports. … linear stepper motor with a
control chip and a motor driver, so … from the building platform, the same support structures can …

On‐chip batteries for dust‐sized computers

Y Li, M Zhu, VK Bandari… - Advanced Energy …, 2022 - Wiley Online Library
structures of microbatteries—stacked thin films on the chip and electrode pillars and interdigitated
microelectrodes on the chip… electrode pillars or building tall electrode pillars leads to a …

Free-standing kinked nanowire transistor probes for targeted intracellular recording in three dimensions

Q Qing, Z Jiang, L Xu, R Gao, L Mai… - Nature nanotechnology, 2014 - nature.com
… In the meantime, to ensure continued support, we are displaying … chip-based multiplexing,
but, so far, preclude targeted recording from specific cell regions and/or subcellular structures. …

[PDF][PDF] 3D Heterogeneous Integration Of Microwave/Millimeter-Wave Sensor And Communications Microsystems Using High-Aspect Ratio Micromachined" Building …

S Raman - 2013 - apps.dtic.mil
… fabricated test structures are shown in Figure 5. In a final assembly step, the vertical metal
posts on the top chip are “plugged” into the liquid-metal-filled sockets on the bottom test chip. …

The USM HALLER stahlbausystem MINI-MIDI-MAXI, designed by Fritz Haller, 1959–1987

C Nozza - History of Construction Cultures Volume 2, 2021 - taylorfrancis.com
… modular steel structural system for the construction of buildings … ground by thirty-six metal
pillars of different heights, arranged … The support surface of the floors is made up of chipboard …

Techniques to reduce thermal resistance in flip‐chip GaN‐based VCSELs

S Mishkat‐Ul‐Masabih, J Leonard… - … status solidi (a), 2017 - Wiley Online Library
… The recessed metal design consists of a column DBR with a diameter slightly larger than …
separate DBR pillars with recessed metal throughout the device to support the structure. Hence…

Realization of a wearable miniaturized thermoelectric generator for human body applications

Z Wang, V Leonov, P Fiorini, C Van Hoof - Sensors and Actuators A …, 2009 - Elsevier
… bonded to a top chip (the air gap is removed for clarity); for ease of building the FEM model,
… Four thermally isolating pillars are placed around the thermopile chip for mechanical support

A new RDL-first PoP fan-out wafer-level package process with chip-to-wafer bonding technology

SN Son, DH Khim, SH Yun, JH Park… - 2020 IEEE 70th …, 2020 - ieeexplore.ieee.org
… However, in this new process, the electroplated copper pillars … This work provides the results
of a test vehicle build using … The temporary carrier wafer acts as a support structure during …