sublimation technique. The films annealed right after the deposition were then immersed in
copper nitrate solution for different periods of time. These films were again annealed at
500oC for 1h to ensure the diffusion of copper in the films. The samples were characterized
by X-ray diffraction and scanning electron microscopy. The electron microprobe analyzer
showed an increase of copper-content in composition. The dc electrical conductivity showed …