Effect of particle size during tungsten chemical mechanical polishing

M Bielmann, U Mahajan, RK Singh - MRS Online Proceedings …, 1999 - cambridge.org
… The effect of alumina particle size during chemical mechanical polishing of tungsten has …
roughness of tungsten was observed for increasing particle size. The tungsten removal rate was …

In situ electrochemical investigation of tungsten electrochemical behavior during chemical mechanical polishing

DJ Stein, D Hetherington, T Guilinger… - Journal of The …, 1998 - iopscience.iop.org
… of tungsten during chemical mechanical polishing (CMP… Chemical mechanical polishing
(CMP) is the most effective and now the predominant method for the removal of excess tungsten

Tungsten chemical mechanical polishing

N Elbel, B Neureither, B Ebersberger… - Journal of The …, 1998 - iopscience.iop.org
… of the polishing result, have not yet been presented. This paper presents a model for tungsten
CMP which quantitatively describes the relationship between CMP process parameters (…

Electrochemical measurements during the chemical mechanical polishing of tungsten thin films

EA Kneer, C Raghunath, V Mathew… - Journal of the …, 1997 - iopscience.iop.org
… mechanism for tungsten removal. Atomic force microscopy scans of polished tungsten films
… be an important removal mechanism for tungsten during chemical mechanical polishing. …

Electrochemistry of chemical vapor deposited tungsten films with relevance to chemical mechanical polishing

EA Kneer, C Raghunath, S Raghavan… - Journal of the …, 1996 - iopscience.iop.org
… It was found that in the absence of an oxidizer, the tungsten surface was passivated most …
in tungsten dissolution. Introduction The chemical mechanical polishing (CMP) of tungsten is …

Studies on passivation behavior of tungsten in application to chemical mechanical polishing

D Tamboli, S Seal, V Desai, A Maury - Journal of Vacuum Science & …, 1999 - pubs.aip.org
… low pressure chemical vapor deposition LPCVD process are the … The processing steps
include deposition of blanket tungstentungsten by chemical mechanical polishing CMP process. …

Modeling and characterization of tungsten chemical and mechanical polishing processes

J Zabasajja, T Merchant, B Ng… - Journal of the …, 2001 - iopscience.iop.org
… Due to the complexity of chemical mechanical polishing (CMP) in general and metal CMP in
… the tungsten CMP process. While the chemical Preston model is used to explain the effect of …

An optimization of tungsten plug chemical mechanical polishing (CMP) using different consumables

WS Lee, SY Kim, YJ Seo, JK Lee - Journal of Materials Science: Materials …, 2001 - Springer
… -CMP process to improve the qualities of the polished wafers. … pad to polish most of the bulk
tungsten with a high polish rate. … additive to slowly polish the remaining tungsten. In this way, …

Probable role of abrasion in chemo-mechanical polishing of tungsten

J Larsen-Basse, H Liang - Wear, 1999 - Elsevier
… In this study, we estimate the probable contributions of abrasion in CMP of tungsten metal,
which is one of the metals used in integrated circuits. The low-pH slurry contains nano-scale …

Chemicalmechanical polishing for fabricating patterned W metal features as chip interconnects

FB Kaufman, DB Thompson, RE Broadie… - Journal of the …, 1991 - iopscience.iop.org
tungsten features if a process chemistry appropriate for wafer fabrication were available.
Chemicalmechanical polishing … The mechanism we propose for the process (Fig. 2) requires the …