In this paper we use the computer simulation of dense suspensions introduced in Part I to simulate the flow of solder paste during stencil printing for reflow soldering in surface-mount technology (SMT). In order to understand the results of the simulation better, we first simulate the flow of solder paste between two parallel plates, in an arrangement similar to that found in a parallel plate viscometer. We then proceed to examine the results for flow of paste out of a stencil aperture. The aperture width, height, angle of wall inclination, particle size and concentration of the suspension are all varied to see the effect on tensile stress in the paste, and flow patterns. The most significant effect occurs when the angle of wall inclination is changed, and it is argued that walls should be inclined to reduce paste skipping (i.e. shorts on the reflowed PCB). Insight is gained into the phenomenon of skipping in general.